1. 2. 3. material content data sheet sales product name BSC010NE2LSI issued 14. august 2015 ma# ma001010842 package pg-tdson-8-7 weight* 118.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.009 0.85 0.85 8485 8485 leadframe non noble metal iron 7439-89-6 0.038 0.03 318 inorganic material phosphorus 7723-14-0 0.011 0.01 95 non noble metal copper 7440-50-8 37.762 31.72 31.76 317425 317838 wire noble metal gold 7440-57-5 0.044 0.04 0.04 374 374 encapsulation organic material carbon black 1333-86-4 0.087 0.07 729 plastics epoxy resin - 6.156 5.18 51751 inorganic material silicondioxide 60676-86-0 37.112 31.20 36.45 311962 364442 leadfinish non noble metal tin 7440-31-5 1.470 1.24 1.24 12355 12355 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1391 1391 solder noble metal silver 7440-22-4 0.036 0.03 305 non noble metal tin 7440-31-5 0.029 0.02 244 non noble metal lead 7439-92-1 1.387 1.17 1.22 11658 12207 heatspreader non noble metal iron 7439-89-6 0.011 0.01 95 inorganic material phosphorus 7723-14-0 0.003 0.00 29 non noble metal copper 7440-50-8 11.320 9.52 9.53 95156 95280 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 188 inorganic material phosphorus 7723-14-0 0.007 0.01 56 non noble metal copper 7440-50-8 22.292 18.74 18.77 187384 187628 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
